Navigating the AI Memory Era
SK Hynix President Kwak Noh-jung emphasized that while the memory market used to resemble a straight road of pure speed competition, it is now like a dynamic curve requiring flexible adaptation to rapid external changes. Speaking at the SK Hynix Future Forum held at the Icheon campus in South Korea on September 8, 2026, he highlighted the importance of reading market shifts.
Customized Memory Hierarchy for AI
As artificial intelligence continues to evolve, the memory hierarchy combining High Bandwidth Memory (HBM), DRAM, and Solid State Drives (SSDs) is becoming increasingly critical. According to Yonhap News, SK Hynix is pursuing a strategy to combine 3D stacked DRAM, HBM, and High Bandwidth Flash (HBF) tailored specifically for AI workloads, collaborating closely with customers starting from the system design phase. Kwak concluded that the company will unlock unprecedented possibilities amid the transforming AI ecosystem.
